High Speed Design Center and PacketMicro Announce Handheld TDR BladeProbes and Accessories for Signal Integrity Measurement
Poster: SySAdmin
Posted on November 8, 2010 at 6:21:01 AM
High Speed Design Center and PacketMicro Announce Handheld TDR BladeProbes and Accessories for Signal Integrity Measurement
TDR BladeProbe and impedance standard substrate provide unprecedented tools for high-speed designers and manufacturers to validate PCB impedance.
SANTA CLARA, Calif., Nov. 8, 2010 /PRNewswire/ -- High Speed Design Center (HSDC) and PacketMicro announced today that they are offering a family of handheld TDR BladeProbes and an impedance standard substrate to the US market. The high-bandwidth, fixed-pitch probe design enables accurate and repeatable impedance measurements for high-speed PCB development and manufacturing.
"The BladeProbe offering provides the best combination of performance, accuracy and price," said Ben Chia, HSDC President. "BladeProbe and impedance standard substrate help designers and manufacturing houses to correlate their impedance measurements. The impedance references of TCS10 substrate are accurate to within 0.15% of stated values. The TDR BladeProbe can be used as a handheld test tool or be mounted on a probe positioner for stable, hands-free measurement."
TDR BladeProbe and calibration substrate are the first offering of a series of Signal Integrity development and manufacturing tools by HSDC. The TDR BladeProbe family includes 2-pin (in SS configuration) and 4-pin (in GSSG configuration) differential probes with 1.0 mm/0.8 mm/0.6 mm/0.4 mm pitches. The TCS10 substrate offers open/short/through and 50/85/100 ohm standards.
About High Speed Design Center
High Speed Design Center (HSDC), based in Silicon Valley, is specialized in the areas of Signal Integrity and Power Integrity for GHz high-speed interconnect devices and systems. It offers probes, calibration substrates, probe stations, and accessories. HSDC also provides engineering services in measurements and simulations. HSDC TDR BladeProbes and impedance standard substrates are sold through PacketMicro.
About PacketMicro
PacketMicro, based in Silicon Valley, offers world-class designs in the wireless sensor networks and radio frequency identification areas. It provides one-stop engineering services, including FCC certified wireless subsystems, to help its customers shorten their product development cycles. PacketMicro also provides design services in the Signal Integrity and FPGA areas. For more information, please visit http://www.packetmicro.com.
This press release was issued through 24-7PressRelease.com. For further information, visit http://www.24-7pressrelease.com.
SOURCE PacketMicro, Inc.
PacketMicro, Inc.
CONTACT: Ching Hu of PacketMicro, Inc., +1-408-235-7639, chinghu@packetmicro.com
Web Site: http://www.packetmicro.com
TDR BladeProbe and impedance standard substrate provide unprecedented tools for high-speed designers and manufacturers to validate PCB impedance.
SANTA CLARA, Calif., Nov. 8, 2010 /PRNewswire/ -- High Speed Design Center (HSDC) and PacketMicro announced today that they are offering a family of handheld TDR BladeProbes and an impedance standard substrate to the US market. The high-bandwidth, fixed-pitch probe design enables accurate and repeatable impedance measurements for high-speed PCB development and manufacturing.
"The BladeProbe offering provides the best combination of performance, accuracy and price," said Ben Chia, HSDC President. "BladeProbe and impedance standard substrate help designers and manufacturing houses to correlate their impedance measurements. The impedance references of TCS10 substrate are accurate to within 0.15% of stated values. The TDR BladeProbe can be used as a handheld test tool or be mounted on a probe positioner for stable, hands-free measurement."
TDR BladeProbe and calibration substrate are the first offering of a series of Signal Integrity development and manufacturing tools by HSDC. The TDR BladeProbe family includes 2-pin (in SS configuration) and 4-pin (in GSSG configuration) differential probes with 1.0 mm/0.8 mm/0.6 mm/0.4 mm pitches. The TCS10 substrate offers open/short/through and 50/85/100 ohm standards.
About High Speed Design Center
High Speed Design Center (HSDC), based in Silicon Valley, is specialized in the areas of Signal Integrity and Power Integrity for GHz high-speed interconnect devices and systems. It offers probes, calibration substrates, probe stations, and accessories. HSDC also provides engineering services in measurements and simulations. HSDC TDR BladeProbes and impedance standard substrates are sold through PacketMicro.
About PacketMicro
PacketMicro, based in Silicon Valley, offers world-class designs in the wireless sensor networks and radio frequency identification areas. It provides one-stop engineering services, including FCC certified wireless subsystems, to help its customers shorten their product development cycles. PacketMicro also provides design services in the Signal Integrity and FPGA areas. For more information, please visit http://www.packetmicro.com.
This press release was issued through 24-7PressRelease.com. For further information, visit http://www.24-7pressrelease.com.
SOURCE PacketMicro, Inc.
PacketMicro, Inc.
CONTACT: Ching Hu of PacketMicro, Inc., +1-408-235-7639, chinghu@packetmicro.com
Web Site: http://www.packetmicro.com