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Poster: SySAdmin
Posted on April 26, 2011 at 2:35:01 PM
Visit ADLINK at the ESC Silicon Valley for Embedded Solutions Based on the Latest Intel® Microarchitectures
Product focus includes platforms featuring the 2nd generation Intel® Core(TM) processor family and the Intel® Atom(TM) processor E6xx series as well as rugged fanless embedded computers and compact vision systems
SAN JOSE, Calif., April 26, 2011 /PRNewswire/ -- ADLINK Technology, Inc., a leading provider of embedded platform products and services, will present their newest products based on the latest Intel® technology at the Embedded Systems Conference Silicon Valley from May 3 to 5, 2011 in San Jose, CA. Product highlights include ADLINK's new embedded platforms which utilize the new Intel® Core(TM) i7/i5/i3 processors, Intel® Q67 chipset and Intel® QM67 Express chipset in a variety of form factors, such as CompactPCI®, COM Express(TM), PICMG® 1.3, ATX and Mini-ITX. These highly-integrated embedded solutions offer customers advanced technologies and new levels of computing performance for applications including transportation, military, medical, gaming and factory automation. Customers looking for I/O flexibility in embedded applications will find the solution in ADLINK's new "Ultra" size COM Express(TM) module featuring Intel® Atom(TM) Processor E6xx Series, which also come in an Extreme Rugged(TM) version for deployment in harsh environments.
ADLINK will also showcase the rugged fanless embedded computers and compact vision systems based on the latest Intel® microarchitectures. The ADLINK Matrix series of embedded computers provide comprehensive and reliable solutions for industrial applications such as transportation, energy-related fields, and machine automation. The new embedded vision system, the EOS series, adopts the Intel® Core(TM)2 Duo processor and provides high computing power for multi-camera support, making it ideal for applications such as 3D vision robotic guidance.
Other products on display are the newest additions to the Ampro by ADLINK(TM) Extreme Rugged(TM) product line. Rugged by design products can withstand high shock/vibration conditions and have an extended operating temperature range of -40 to +85 degrees C. ADLINK's product presentation shows that the company has advanced to the next milestone as an embedded computing products and services provider. Visit ADLINK at Booth 1910, ESC Silicon Valley to witness the progress and experience ADLINK's products in person.
About ADLINK
ADLINK Technology provides embedded computing products and services to the test & measurement, automation, gaming, communications, medical, and transportation industries. ADLINK products include DAQ and I/O; vision and motion control; AdvancedTCA®, CompactPCI®, Computer-on-Modules (COMs), as well as Extreme Rugged products under the brand name Ampro by ADLINK.
SOURCE ADLINK Technology, Inc.
ADLINK Technology, Inc.
CONTACT: Cindy Lee of ADLINK Technology, Inc., +1-408-360-4381, cindy.lee@adlinktech.com
Product focus includes platforms featuring the 2nd generation Intel® Core(TM) processor family and the Intel® Atom(TM) processor E6xx series as well as rugged fanless embedded computers and compact vision systems
SAN JOSE, Calif., April 26, 2011 /PRNewswire/ -- ADLINK Technology, Inc., a leading provider of embedded platform products and services, will present their newest products based on the latest Intel® technology at the Embedded Systems Conference Silicon Valley from May 3 to 5, 2011 in San Jose, CA. Product highlights include ADLINK's new embedded platforms which utilize the new Intel® Core(TM) i7/i5/i3 processors, Intel® Q67 chipset and Intel® QM67 Express chipset in a variety of form factors, such as CompactPCI®, COM Express(TM), PICMG® 1.3, ATX and Mini-ITX. These highly-integrated embedded solutions offer customers advanced technologies and new levels of computing performance for applications including transportation, military, medical, gaming and factory automation. Customers looking for I/O flexibility in embedded applications will find the solution in ADLINK's new "Ultra" size COM Express(TM) module featuring Intel® Atom(TM) Processor E6xx Series, which also come in an Extreme Rugged(TM) version for deployment in harsh environments.
ADLINK will also showcase the rugged fanless embedded computers and compact vision systems based on the latest Intel® microarchitectures. The ADLINK Matrix series of embedded computers provide comprehensive and reliable solutions for industrial applications such as transportation, energy-related fields, and machine automation. The new embedded vision system, the EOS series, adopts the Intel® Core(TM)2 Duo processor and provides high computing power for multi-camera support, making it ideal for applications such as 3D vision robotic guidance.
Other products on display are the newest additions to the Ampro by ADLINK(TM) Extreme Rugged(TM) product line. Rugged by design products can withstand high shock/vibration conditions and have an extended operating temperature range of -40 to +85 degrees C. ADLINK's product presentation shows that the company has advanced to the next milestone as an embedded computing products and services provider. Visit ADLINK at Booth 1910, ESC Silicon Valley to witness the progress and experience ADLINK's products in person.
About ADLINK
ADLINK Technology provides embedded computing products and services to the test & measurement, automation, gaming, communications, medical, and transportation industries. ADLINK products include DAQ and I/O; vision and motion control; AdvancedTCA®, CompactPCI®, Computer-on-Modules (COMs), as well as Extreme Rugged products under the brand name Ampro by ADLINK.
SOURCE ADLINK Technology, Inc.
ADLINK Technology, Inc.
CONTACT: Cindy Lee of ADLINK Technology, Inc., +1-408-360-4381, cindy.lee@adlinktech.com