Redpine Signals Releases First Ultra Low Power 802.11ac Technology for Smartphone Application Processors
Redpine's new Quali-Fi(TM) 802.11ac implementation delivers high throughput Wi-Fi links on mobile devices under adverse RF environments
SAN JOSE, Calif., Dec 14, 2011 /PRNewswire/ -- Redpine Signals, Inc., a leading developer of ultra low power and high-performance multi-standard wireless chipsets and systems, today announced the release of the industry's first IEEE 802.11ac technology offering for integration into smartphone application processors and mobile combo chips. By developing the latest Wi-Fi technology, Redpine helps to drive the market for mobile devices with even faster data rates and low power consumption.
Redpine's Quali-Fi(TM) 802.11ac ultra low power technology addresses the emerging markets for wire speed data transfers over wireless, enabling high utilization of the increasingly crowded license-free spectrum. The standard focuses on the 5 GHz band with its wide array of available channels. It also increases data rates through a combination of wider channel bandwidth - up from 40 MHz in 11n to 80 MHz and 160 MHz - more complex 256 QAM modulations and MIMO streams.
"Our Quali-Fi(TM) technology leverages proven low power innovations spanning over ten years and provides an optimal solution for integration into smart phone application processors and mobile combo chips," said Venkat Mattela, CEO of Redpine Signals. "This industry-first offering would enable the early adoption of the next generation Wi-Fi technology into mobile computing products. Redpine has had a long history of releasing innovative ultra low power products in the wireless arena. Our low power 802.11b/g product was released in 2005, which was followed by our pioneering single-stream 802.11n product in 2007, and now with our 802.11ac offering, we are continuing with our tradition of being industry first in low power Wi-Fi technology for the mobile market."
Redpine's Quali-Fi licensable product includes extensive hooks for supporting coexistence among the host of other wireless technologies available in smartphones, tablets and other mobile products, with innovations supporting high wireless performance on WLAN as well as on other wireless interfaces. And with legacy 802.11abgn support, it also provides the simultaneous dual-band operation that Redpine pioneered in its Maxi-FiĀ® BEAM450(TM) product for efficient operation in future RF environments. Other performance enhancing features include advanced beamforming, multi-user MIMO, LDPC, and flexible use of non-contiguous channels to enable higher bandwidth operation.
The Quali-Fi product is accompanied by Redpine's software framework that includes an access point, Wi-Fi certified client and Redpine's Wi-Fi Direct(TM) functionality.
About Redpine Signals, Inc.
Headquartered in San Jose, California, Redpine Signals, Inc., is a fabless semiconductor and wireless system solutions company focusing on ultra-low-power and high-performance products for next-generation wireless applications. Redpine was founded in 2001 and was the first in the industry to launch an ultra low power and low-cost single-stream 802.11n chipset in late 2007. Redpine offers chipsets, modules and solutions covering multiple market segments including industrial, consumer electronics, medical, mobile, PC, and smart energy. Its technology portfolio includes multi-stream 802.11n along with mobile WiMax (802.16e) and LTE technologies. The company has more than 120 employees worldwide. For more information on Redpine products, visit http://www.redpinesignals.com/ or contact Redpine at info@redpinesignals.com.
Redpine Contact Information
Venkat Mattela
Chief Executive Officer
Redpine Signals, Inc.
Phone: +1 408-748-3385 x207
Email : venkat.mattela@redpinesignals.com
Web : http://www.redpinesignals.com
Redpine Signals, the Redpine logo, Lite-Fi, and Maxi-Fi are registered trademarks of Redpine Signals, Inc. All other company names, products and logos are registered trademarks of their respective companies.