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NVM Express Conformance and Interoperability Test Platform Supports University of New Hampshire Test Suite
NVM Express Testing for PCIe® SSDs
SANTA CLARA, Calif., Aug. 21, 2012 /PRNewswire/ -- Teledyne LeCroy Corporation, the worldwide leader in protocol test solutions, today provided a first demonstration of the new University of New Hampshire Interoperability Lab (UNH-IOL) NVM Express Conformance and Interoperability Tests. The hardware test platform used for this new conformance test suite is the Teledyne LeCroy Summit(TM) Z3-16 Exerciser, and was shown at the 2012 Flash Memory Summit. The conformance tests are based on the UNH-IOL NVM Express Conformance Test Suite Document published earlier this year. UNH-IOL will provide NVM Express conformance testing services in the near future to ensure proper standardization in the rapidly growing NVM Express solid-state storage device (SSD) market.
"We have leveraged our technical experience and relationships in the storage industry to develop this new NVM Express conformance test suite," stated David Woolf, Senior Engineer at UNH-IOL. "The Teledyne LeCroy Summit Z3-16 Exerciser will provide an easy-to-use and reliable test platform to run the conformance tests at our future NVM Express test workshops. The reporting capability of this tool will help us to make our events more effective and maximize the testing experience."
The Teledyne LeCroy Summit Z3-16 Exerciser supports all PCIe speeds from 2.5 GT/ s up to 8 GT/s, and can support lane widths of x1, x2, x4, x8 and x16. The versatility of this test tool lends itself to SSD device testing for NVM Express, SCSI Express (SOP/PQI) and SATA Express (AHCI/PCIe) SSD storage systems. The Summit Z3-16 Exerciser can be configured to do both host and device testing using the included library of scripted tests, or can create new tests for hosts and devices with the included script creation tools.
The drive to adopt NVM Express (a storage-optimized variant of the PCIe interface standard for SSDs) was led by the NVM Express Work Group, and now has an interoperability test lab at the University of New Hampshire. The UNH-IOL has been instrumental in developing storage testing services and hosting interoperability test events for the last several years. The UNH-IOL - described as a "neutral, third-party laboratory dedicated to testing data networking technologies through industry collaboration" - has been developing an interoperability test suite for the last several months. The NVM Express Work Group consists of more than 90 member companies, including a core group of ten "promoters": Cisco, Dell, EMC, IDT, Intel, Micron, NetApp, Oracle, SandForce (LSI), and STEC.
"The University of New Hampshire Interoperability Lab is widely recognized for its commitment to a high-quality testing experience for their customers," said John Wiedemeier, Product Marketing Manager for the Interconnect Communications Group, Teledyne LeCroy Corporation. "The Summit Z3-16 Exerciser provides a capable and reliable platform choice for this high standard of testing. The comprehensive NVM Express emulation and detailed test script creation have made it possible to implement the unique testing required by the UNH-IOL conformance test specifications. We expect all UNH-IOL customers will have comprehensive testing capability with these tools."
Teledyne LeCroy's protocol analyzers have been at the forefront of PCI Express development. All Teledyne LeCroy protocol analyzers feature a hierarchical display, real-time statistics, protocol traffic summaries, detailed error reports, powerful scripting, and the ability to create user-defined test reports which allow developers to troubleshoot intricate problems and finish their projects on time.
Availability
The UNH-IOL Conformance Test can be seen in the Teledyne LeCroy's booth at the Flash Memory Summit (Booth #706) For additional information, contact Teledyne LeCroy at 1-800-5Teledyne LeCroy (1-800-553-2769) or visit teledynelecroy.com.
About Teledyne LeCroy
Teledyne LeCroy Corporation is a worldwide leader in serial data test solutions, creating advanced instruments that drive product innovation by quickly measuring, analyzing and verifying complex electronic signals. The Company offers high-performance oscilloscopes, signal integrity test solutions and global communications protocol analyzers used by design engineers in the computer, semiconductor and consumer electronics, data storage, automotive and industrial, telecommunications, and military and aerospace markets. Teledyne LeCroy's 48-year heritage of technical innovation is the foundation for its recognized leadership in "WaveShape Analysis" - capturing, viewing and measuring the high-speed signals that drive today's information and communications technologies. Teledyne LeCroy is headquartered in Chestnut Ridge, New York. Company information is available at teledynelecroy.com.
© 2012 by Teledyne LeCroy Corporation. All rights reserved. Specifications are subject to change without notice.
SOURCE Teledyne LeCroy Corporation
Teledyne LeCroy Corporation
CONTACT: Media contact: Peter Fletcher, TechniPubs, +1-408-373-5601; Teledyne LeCroy Contact: John Wiedemeier, Product Marketing Manager, +1-408-486-7211; Customer contact: Teledyne LeCroy Customer Care Center, 800-553-2769
Web Site: http://www.teledynelecroy.com
NVM Express Conformance and Interoperability Test Platform Supports University of New Hampshire Test Suite
NVM Express Testing for PCIe® SSDs
SANTA CLARA, Calif., Aug. 21, 2012 /PRNewswire/ -- Teledyne LeCroy Corporation, the worldwide leader in protocol test solutions, today provided a first demonstration of the new University of New Hampshire Interoperability Lab (UNH-IOL) NVM Express Conformance and Interoperability Tests. The hardware test platform used for this new conformance test suite is the Teledyne LeCroy Summit(TM) Z3-16 Exerciser, and was shown at the 2012 Flash Memory Summit. The conformance tests are based on the UNH-IOL NVM Express Conformance Test Suite Document published earlier this year. UNH-IOL will provide NVM Express conformance testing services in the near future to ensure proper standardization in the rapidly growing NVM Express solid-state storage device (SSD) market.
"We have leveraged our technical experience and relationships in the storage industry to develop this new NVM Express conformance test suite," stated David Woolf, Senior Engineer at UNH-IOL. "The Teledyne LeCroy Summit Z3-16 Exerciser will provide an easy-to-use and reliable test platform to run the conformance tests at our future NVM Express test workshops. The reporting capability of this tool will help us to make our events more effective and maximize the testing experience."
The Teledyne LeCroy Summit Z3-16 Exerciser supports all PCIe speeds from 2.5 GT/ s up to 8 GT/s, and can support lane widths of x1, x2, x4, x8 and x16. The versatility of this test tool lends itself to SSD device testing for NVM Express, SCSI Express (SOP/PQI) and SATA Express (AHCI/PCIe) SSD storage systems. The Summit Z3-16 Exerciser can be configured to do both host and device testing using the included library of scripted tests, or can create new tests for hosts and devices with the included script creation tools.
The drive to adopt NVM Express (a storage-optimized variant of the PCIe interface standard for SSDs) was led by the NVM Express Work Group, and now has an interoperability test lab at the University of New Hampshire. The UNH-IOL has been instrumental in developing storage testing services and hosting interoperability test events for the last several years. The UNH-IOL - described as a "neutral, third-party laboratory dedicated to testing data networking technologies through industry collaboration" - has been developing an interoperability test suite for the last several months. The NVM Express Work Group consists of more than 90 member companies, including a core group of ten "promoters": Cisco, Dell, EMC, IDT, Intel, Micron, NetApp, Oracle, SandForce (LSI), and STEC.
"The University of New Hampshire Interoperability Lab is widely recognized for its commitment to a high-quality testing experience for their customers," said John Wiedemeier, Product Marketing Manager for the Interconnect Communications Group, Teledyne LeCroy Corporation. "The Summit Z3-16 Exerciser provides a capable and reliable platform choice for this high standard of testing. The comprehensive NVM Express emulation and detailed test script creation have made it possible to implement the unique testing required by the UNH-IOL conformance test specifications. We expect all UNH-IOL customers will have comprehensive testing capability with these tools."
Teledyne LeCroy's protocol analyzers have been at the forefront of PCI Express development. All Teledyne LeCroy protocol analyzers feature a hierarchical display, real-time statistics, protocol traffic summaries, detailed error reports, powerful scripting, and the ability to create user-defined test reports which allow developers to troubleshoot intricate problems and finish their projects on time.
Availability
The UNH-IOL Conformance Test can be seen in the Teledyne LeCroy's booth at the Flash Memory Summit (Booth #706) For additional information, contact Teledyne LeCroy at 1-800-5Teledyne LeCroy (1-800-553-2769) or visit teledynelecroy.com.
About Teledyne LeCroy
Teledyne LeCroy Corporation is a worldwide leader in serial data test solutions, creating advanced instruments that drive product innovation by quickly measuring, analyzing and verifying complex electronic signals. The Company offers high-performance oscilloscopes, signal integrity test solutions and global communications protocol analyzers used by design engineers in the computer, semiconductor and consumer electronics, data storage, automotive and industrial, telecommunications, and military and aerospace markets. Teledyne LeCroy's 48-year heritage of technical innovation is the foundation for its recognized leadership in "WaveShape Analysis" - capturing, viewing and measuring the high-speed signals that drive today's information and communications technologies. Teledyne LeCroy is headquartered in Chestnut Ridge, New York. Company information is available at teledynelecroy.com.
© 2012 by Teledyne LeCroy Corporation. All rights reserved. Specifications are subject to change without notice.
SOURCE Teledyne LeCroy Corporation
Teledyne LeCroy Corporation
CONTACT: Media contact: Peter Fletcher, TechniPubs, +1-408-373-5601; Teledyne LeCroy Contact: John Wiedemeier, Product Marketing Manager, +1-408-486-7211; Customer contact: Teledyne LeCroy Customer Care Center, 800-553-2769
Web Site: http://www.teledynelecroy.com