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Broadcom Introduces First Femtocell Chip to Integrate RF and Baseband Modem
Single-chip Device Boosts Data Speeds to Home-based 3G Femtocells
BARCELONA, Spain, Feb. 25, 2013 /PRNewswire/ -- Mobile World Congress 2013 --
News Highlights:
-- Industry's first integrated digital baseband processor and RF
transceiver for 3G small cell base stations and femtocell access points
-- CMOS SoC provides low cost, power efficient and small form factor
solution
-- High-performance, single-chip design accelerates small cell development
and deployment time
Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today introduced a highly integrated digital baseband processor and RF transceiver designed for 3G femtocell residential access points. With the new system-on-a-chip (SoC), mobile operator OEMs and ODMs have a powerful, low-cost, power efficient device to support small cell strategies and meet growing mobile traffic demands. Visit Broadcom @ Mobile World Congress for more news.
"As on-the-go content consumption continues to drive traffic growth, mobile operators must meet consumers' increasing demand for higher bandwidth without sacrificing quality of service," said Greg Fischer, Broadcom's Vice President and General Manager for Broadband Carrier Access. "Broadcom's BCM61630 SoCs deliver a low-power, cost-efficient device for residential small cells to leverage existing mobile infrastructure and deliver faster data speeds through a smaller form factor."
The new devices further integrate a multiband CMOS RF transceiver with GPS and full time sniffing capability while maintaining software compatibility with all previous Broadcom WCDMA physical layer and backhauling interface architectures. Embedding a high speed CPU and Broadcom's field-proven Layer 1 modem and peripherals, these devices provide a complete low power single chip solution for residential and small enterprise 3G small cell deployments.
Market Drivers
-- Residential small cells, also known as femtocells, address quality of
service issues for users in and around the home by extending mobile
operator reach
-- Small cells address rapid growth of mobile data traffic and quality of
service issues compounded by the migration to 3G by offloading traffic
from the macro network(1)
-- The 3G femtocell market is expected to grow at a global compounded
annual growth rate of 94 percent from 2011-2016(2)
Key Features of the BCM61630
-- Highly integrated CMOS device
-- Second generation in Broadcom's line of WCDMA femtocell access point
SoCs
-- High HSPA data rates with maximum throughput at up to 21.6 Mbps
-- Advanced SON and sniffing capabilities without addition of external
components
-- Highly integrated multiband RF and soft GPS receiver enable ultra-low
power(3 )and lowest cost bill of materials
-- USIM Interface
Availability
Volume production for the BCM61630 is slated for 1H 2013.
For ongoing Broadcom news visit our Newsroom, read our B-Connected Blog, or visit us on Facebook or Twitter. And to stay connected, subscribe to our RSS Feed.
Resources
(1) ABI Research, 2013.
(2) Infonetics, 2012.
(3) BCM61630 delivers ultra-low power consumption 1.5W nominal (Digital Baseband, RF and Ethernet).
About Broadcom
Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments. With the industry's broadest portfolio of state-of-the-art system-on-a-chip and embedded software solutions, Broadcom is changing the world by Connecting everything®. For more information, go to http://www.broadcom.com.
Broadcom®, the pulse logo, Connecting everything® and the Connecting everything logo are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU. Any other trademarks or trade names mentioned are the property of their respective owners.
Contacts
--------
Press Investors
Isa Loundon Chris Zegarelli
Manager, Product Communications Senior Director, Investor Relations
408-922-7787 949-926-7567
isa@broadcom.com czegarel@broadcom.com
SOURCE Broadcom Corporation; BRCM Broadband
Photo:http://photos.prnewswire.com/prnh/20060609/BROADCOMLOGO
http://photoarchive.ap.org/
Broadcom Corporation; BRCM Broadband
Web Site: http://www.broadcom.com
Broadcom Introduces First Femtocell Chip to Integrate RF and Baseband Modem
Single-chip Device Boosts Data Speeds to Home-based 3G Femtocells
BARCELONA, Spain, Feb. 25, 2013 /PRNewswire/ -- Mobile World Congress 2013 --
News Highlights:
-- Industry's first integrated digital baseband processor and RF
transceiver for 3G small cell base stations and femtocell access points
-- CMOS SoC provides low cost, power efficient and small form factor
solution
-- High-performance, single-chip design accelerates small cell development
and deployment time
Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today introduced a highly integrated digital baseband processor and RF transceiver designed for 3G femtocell residential access points. With the new system-on-a-chip (SoC), mobile operator OEMs and ODMs have a powerful, low-cost, power efficient device to support small cell strategies and meet growing mobile traffic demands. Visit Broadcom @ Mobile World Congress for more news.
"As on-the-go content consumption continues to drive traffic growth, mobile operators must meet consumers' increasing demand for higher bandwidth without sacrificing quality of service," said Greg Fischer, Broadcom's Vice President and General Manager for Broadband Carrier Access. "Broadcom's BCM61630 SoCs deliver a low-power, cost-efficient device for residential small cells to leverage existing mobile infrastructure and deliver faster data speeds through a smaller form factor."
The new devices further integrate a multiband CMOS RF transceiver with GPS and full time sniffing capability while maintaining software compatibility with all previous Broadcom WCDMA physical layer and backhauling interface architectures. Embedding a high speed CPU and Broadcom's field-proven Layer 1 modem and peripherals, these devices provide a complete low power single chip solution for residential and small enterprise 3G small cell deployments.
Market Drivers
-- Residential small cells, also known as femtocells, address quality of
service issues for users in and around the home by extending mobile
operator reach
-- Small cells address rapid growth of mobile data traffic and quality of
service issues compounded by the migration to 3G by offloading traffic
from the macro network(1)
-- The 3G femtocell market is expected to grow at a global compounded
annual growth rate of 94 percent from 2011-2016(2)
Key Features of the BCM61630
-- Highly integrated CMOS device
-- Second generation in Broadcom's line of WCDMA femtocell access point
SoCs
-- High HSPA data rates with maximum throughput at up to 21.6 Mbps
-- Advanced SON and sniffing capabilities without addition of external
components
-- Highly integrated multiband RF and soft GPS receiver enable ultra-low
power(3 )and lowest cost bill of materials
-- USIM Interface
Availability
Volume production for the BCM61630 is slated for 1H 2013.
For ongoing Broadcom news visit our Newsroom, read our B-Connected Blog, or visit us on Facebook or Twitter. And to stay connected, subscribe to our RSS Feed.
Resources
(1) ABI Research, 2013.
(2) Infonetics, 2012.
(3) BCM61630 delivers ultra-low power consumption 1.5W nominal (Digital Baseband, RF and Ethernet).
About Broadcom
Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments. With the industry's broadest portfolio of state-of-the-art system-on-a-chip and embedded software solutions, Broadcom is changing the world by Connecting everything®. For more information, go to http://www.broadcom.com.
Broadcom®, the pulse logo, Connecting everything® and the Connecting everything logo are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU. Any other trademarks or trade names mentioned are the property of their respective owners.
Contacts
--------
Press Investors
Isa Loundon Chris Zegarelli
Manager, Product Communications Senior Director, Investor Relations
408-922-7787 949-926-7567
isa@broadcom.com czegarel@broadcom.com
SOURCE Broadcom Corporation; BRCM Broadband
Photo:http://photos.prnewswire.com/prnh/20060609/BROADCOMLOGO
http://photoarchive.ap.org/
Broadcom Corporation; BRCM Broadband
Web Site: http://www.broadcom.com