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IBM has announced that the first 'Broadway' CPUs created for the Nintendo Wii are being shipped from the company's East Fishkill, N.Y., fabrication facility to Nintendo, as the company ramps up for the launch of the next-gen console later this year. Under the terms of the agreement, IBM will produce millions of fully tested, Power Architecture-based chips featuring IBM Silicon on Insulator (SOI) technology at 90 nanometers (90 billionths of a meter), based on the specifications of the custom design agreement previously agreed upon by the two companies.