Microsemi's Mainstream FPGA Portfolio Now Includes New Small Packages for Applications Requiring Small Form Factor
Poster: SySAdmin
Posted on January 14, 2014 at 7:14:01 AM
Microsemi's Mainstream FPGA Portfolio Now Includes New Small Packages for Applications Requiring Small Form Factor
New Small Packaging Options Deliver up to an Additional 50 Percent PCB Area Savings and Solidify the Company's Position as a Market Leader in Small Form Factor, Single-chip Programmable Logic Solutions
ALISO VIEJO, Calif., Jan. 14, 2014 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of new small form factor solutions for its mainstream, SERDES-based SmartFusion(r)2 System-on-Chip (SoC) FPGAs and IGLOO(r)2 FPGAs. The non-volatile configuration of these two FPGA devices eliminates the need for external configuration memories, offering designers the smallest footprint available in the industry. The introduction of the new packages extends Microsemi's portfolio of true flash-based programmable logic devices, adding a variety of small form factor packages for both device families, including FCS325 11x11mm, VF256 14x14mm, FCV484 19x19 and VQ144 22x22mm.
(Logo: http://photos.prnewswire.com/prnh/20110909/MM66070LOGO)
"Increased customer demand for highly reliable, secure, and small footprint SoC FPGAs and FPGA solutions are the catalyst for delivering our newest mainstream FPGAs in a variety of small form factor solutions," said Tim Morin, director of marketing at Microsemi. "We are pleased to expand our mainstream FPGA portfolio and provide our customers with additional competitive advantages."
Microsemi's mainstream flash-based FPGAs inherently reduce board space requirements and the introduction of the new small form factor solutions further extends this advantage. For example, the SPI flash required to configure a 90K LE SRAM-based FPGA can consume approximately 100 square millimeters (mm) of additional board real estate, which is approximately the entire area the M2S090 device occupies in an 11x11 package. In addition to the up to 50 percent PCB savings, the new package solutions provide increased system reliability by reducing the number of interconnects when compared to competing FPGAs.
Optimized for use in communications, military/defense, industrial automation, automotive and video/imaging markets, the new small form factor solutions address the industry's increasing demand for smaller footprint solutions and extends Microsemi's reach into these markets. This advantage provides its customers with a reduction of total cost of ownership and gives designers of applications such as Smart SFP(TM), secure public safety radios and small form factor geo-physical sensors access to the most advanced security, highest reliability and lowest power devices in the market today.
About SmartFusion2 SoC FPGAs
Microsemi's SmartFusion2 SoC FPGAs are designed to address fundamental requirements for advanced security, high reliability and low power in critical communications, industrial, defense, aviation and medical applications. SmartFusion2 integrates inherently reliable flash-based FPGA fabric, a 166 megahertz (MHz) ARM Cortex-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM and industry-required high performance communication interfaces, all on a single chip.
About IGLOO2 FPGAs
Microsemi's IGLOO2 FPGAs continue the company's focus on addressing the needs of today's cost-optimized FPGA markets by providing a LUT based fabric, 5G transceivers, high speed GPIO, block RAM, a high-performance memory subsystem, and DSP blocks in a differentiated, cost and power optimized architecture. This next generation IGLOO2 architecture offers up to five times more logic density and three times more fabric performance than its predecessors and combines a non-volatile flash based fabric with the highest number of general purpose I/Os, 5G SERDES interfaces and PCI Express end points when compared to other products in its class. IGLOO2 FPGAs offer best-in-class feature integration coupled with the lowest power, highest reliability and most advanced security in the industry.
Availability
SmartFusion2 SoC FPGAs and IGLOO2 FPGAs are shipping in volume production now. For more information on SmartFusion2 SoC FPGAS, visit http://www.microsemi.com/products/fpga-soc/soc-fpga/smartfusion2. For more information about IGLOO2 FPGAs, visit http://www.microsemi.com/products/fpga-soc/fpga/igloo2-fpga. Customers can also contact Microsemi's sales team at sales.support@microsemi.com.
About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at http://www.microsemi.com.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its new small form factor solutions for its mainstream, SERDES-based SmartFusion®2 SoC FPGAs and IGLOO®2 FPGAs, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
MSCCP
SOURCE Microsemi Corporation
Photo:http://photos.prnewswire.com/prnh/20110909/MM66070LOGO
http://photoarchive.ap.org/
Microsemi Corporation
CONTACT: Farhad Mafie, VP Worldwide Product Marketing, +1-949-380-6161, OR Beth P. Quezada, Communications Specialist, +1-949-380-6102, press@microsemi.com
Web Site: http://www.microsemi.com
New Small Packaging Options Deliver up to an Additional 50 Percent PCB Area Savings and Solidify the Company's Position as a Market Leader in Small Form Factor, Single-chip Programmable Logic Solutions
ALISO VIEJO, Calif., Jan. 14, 2014 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of new small form factor solutions for its mainstream, SERDES-based SmartFusion(r)2 System-on-Chip (SoC) FPGAs and IGLOO(r)2 FPGAs. The non-volatile configuration of these two FPGA devices eliminates the need for external configuration memories, offering designers the smallest footprint available in the industry. The introduction of the new packages extends Microsemi's portfolio of true flash-based programmable logic devices, adding a variety of small form factor packages for both device families, including FCS325 11x11mm, VF256 14x14mm, FCV484 19x19 and VQ144 22x22mm.
(Logo: http://photos.prnewswire.com/prnh/20110909/MM66070LOGO)
"Increased customer demand for highly reliable, secure, and small footprint SoC FPGAs and FPGA solutions are the catalyst for delivering our newest mainstream FPGAs in a variety of small form factor solutions," said Tim Morin, director of marketing at Microsemi. "We are pleased to expand our mainstream FPGA portfolio and provide our customers with additional competitive advantages."
Microsemi's mainstream flash-based FPGAs inherently reduce board space requirements and the introduction of the new small form factor solutions further extends this advantage. For example, the SPI flash required to configure a 90K LE SRAM-based FPGA can consume approximately 100 square millimeters (mm) of additional board real estate, which is approximately the entire area the M2S090 device occupies in an 11x11 package. In addition to the up to 50 percent PCB savings, the new package solutions provide increased system reliability by reducing the number of interconnects when compared to competing FPGAs.
Optimized for use in communications, military/defense, industrial automation, automotive and video/imaging markets, the new small form factor solutions address the industry's increasing demand for smaller footprint solutions and extends Microsemi's reach into these markets. This advantage provides its customers with a reduction of total cost of ownership and gives designers of applications such as Smart SFP(TM), secure public safety radios and small form factor geo-physical sensors access to the most advanced security, highest reliability and lowest power devices in the market today.
About SmartFusion2 SoC FPGAs
Microsemi's SmartFusion2 SoC FPGAs are designed to address fundamental requirements for advanced security, high reliability and low power in critical communications, industrial, defense, aviation and medical applications. SmartFusion2 integrates inherently reliable flash-based FPGA fabric, a 166 megahertz (MHz) ARM Cortex-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM and industry-required high performance communication interfaces, all on a single chip.
About IGLOO2 FPGAs
Microsemi's IGLOO2 FPGAs continue the company's focus on addressing the needs of today's cost-optimized FPGA markets by providing a LUT based fabric, 5G transceivers, high speed GPIO, block RAM, a high-performance memory subsystem, and DSP blocks in a differentiated, cost and power optimized architecture. This next generation IGLOO2 architecture offers up to five times more logic density and three times more fabric performance than its predecessors and combines a non-volatile flash based fabric with the highest number of general purpose I/Os, 5G SERDES interfaces and PCI Express end points when compared to other products in its class. IGLOO2 FPGAs offer best-in-class feature integration coupled with the lowest power, highest reliability and most advanced security in the industry.
Availability
SmartFusion2 SoC FPGAs and IGLOO2 FPGAs are shipping in volume production now. For more information on SmartFusion2 SoC FPGAS, visit http://www.microsemi.com/products/fpga-soc/soc-fpga/smartfusion2. For more information about IGLOO2 FPGAs, visit http://www.microsemi.com/products/fpga-soc/fpga/igloo2-fpga. Customers can also contact Microsemi's sales team at sales.support@microsemi.com.
About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at http://www.microsemi.com.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its new small form factor solutions for its mainstream, SERDES-based SmartFusion®2 SoC FPGAs and IGLOO®2 FPGAs, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
MSCCP
SOURCE Microsemi Corporation
Photo:http://photos.prnewswire.com/prnh/20110909/MM66070LOGO
http://photoarchive.ap.org/
Microsemi Corporation
CONTACT: Farhad Mafie, VP Worldwide Product Marketing, +1-949-380-6161, OR Beth P. Quezada, Communications Specialist, +1-949-380-6102, press@microsemi.com
Web Site: http://www.microsemi.com