PR: VIA Unveils Mini-ITX 2.0: The Mini PC Platform of the Future
Poster: Aron Schatz
Posted on June 5, 2008 at 1:06:57 PM
Seven years after inventing the form factor, VIA defines the next generation of Mini-ITX platforms enabling greater performance and freedom of choice in small form factor computing and multimedia.
Computex, Taipei, Taiwan, 5 June 2008 - VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced a new standard for Mini-ITX boards to ensure an optimized multimedia and computing experience in small form factor desktop PCs.
Mini-ITX 2.0 is a set of minimum specifications for the next generation of Mini-ITX boards to encourage the integration of the latest PC technologies into the small form factor market and to provide OEMs, system integrators and end-users alike greater freedom of choice in configuring mini PCs and home media centers to deliver an optimized graphics, high definition video, and computing experience. Mini-ITX 2.0 makes the ideal platform for such systems due to its advanced performance, high levels of feature integration, and easy expandability, coupled with the broad infrastructure of cases and accessories that has been built up around the form factor.
Computex, Taipei, Taiwan, 5 June 2008 - VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced a new standard for Mini-ITX boards to ensure an optimized multimedia and computing experience in small form factor desktop PCs.
Mini-ITX 2.0 is a set of minimum specifications for the next generation of Mini-ITX boards to encourage the integration of the latest PC technologies into the small form factor market and to provide OEMs, system integrators and end-users alike greater freedom of choice in configuring mini PCs and home media centers to deliver an optimized graphics, high definition video, and computing experience. Mini-ITX 2.0 makes the ideal platform for such systems due to its advanced performance, high levels of feature integration, and easy expandability, coupled with the broad infrastructure of cases and accessories that has been built up around the form factor.