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Ultratech Introduces Superfast 4G+ Low-Cost In-Line Inspection System For Patterned Wafers
Building on the Field-Proven Superfast 4G, Ultratech's 4G+ Inspection System Provides the Industry's Lowest-Cost 3D Inspection Solution for Advanced 3D Manufacturing
SAN JOSE, Calif., Nov. 11, 2015 /PRNewswire/ -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), as well as atomic layer deposition (ALD) systems, today introduced the Superfast 4G+ in-line, 3D topography inspection system. Ultratech's new 4G+ system builds on the field leadership of the Superfast 4G, providing the industry's highest-productivity and lowest-cost solution for high-volume manufacturing. The Superfast 4G+ system's patented coherent gradient sensing (CGS) technology enables Ultratech customers to use a single type of wafer inspection tool to measure patterned wafers across the entire fab line at the lowest cost. Ultratech plans to begin shipping the Superfast 4G+ systems in the first quarter of 2016.
The Superfast 4G+ leads the industry with features including:
-- Direct, front-side 3D topography measurement for opaque and transparent
stacks patterned wafers
-- 150 wph, the highest industry 3D in-line inspection throughput with the
smallest footprint
-- 1-mm edge exclusion enabling full-wafer pattern inspection and thin-film
3D process control
-- Large bow option for in-line manufacturing control of highly bowed
wafers without impacting throughput
Damon Tsai, Ultratech Asia Director for Inspection Systems, said, "Our current leadership position in in-line 3D inspection at advanced memory and foundry manufacturers with Superfast 4G has provided us with a tremendous learning environment. Our partners have helped us develop new hardware capabilities like the 'Recipe Driven Range Control,' an innovative high-throughput, large bow optical option on board the Superfast 4G+, as well as new fleet management performance metrics. The inherently simple design of the CGS technology is enabling us to rapidly deliver new capabilities and performance improvements over more complex optical solutions."
Ultratech's Superfast 4G+ Inspection System
Based on patented CGS technology, Ultratech's Superfast 4G+ inspection system provides the industry's highest throughput (150 wph) with the lowest cost-of-ownership compared to competing systems. The direct, front-side 3D topography measurement capability is well-suited for patterned wafer applications such as lithography feed-forward overlay distortion and edge-defocus control as well as thin-film deposition stress and planarization control. Delivering a 2X improvement in performance with fleet matching TMU (Total Measurement Uncertainty), along with the ability to measure opaque and transparent stacks on patterned wafers, the Superfast 4G+ provides cost-effective technology to address the critical needs of its global customers. In addition, leveraging the same breakthrough CGS optical module, the Superfast 4G+ is available as a field upgrade of the Superfast 4G.
Safe Harbor
This release includes forward- looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Forward- looking statements can generally be identified by words such as "anticipates," "expects," "remains," "thinks," "intends," "believes," "estimates," and similar expressions and include management's current expectation of its longer term prospects for success. These forward- looking statements are based on our current expectations, estimates, assumptions and projections about our business and industry, and the markets and customers we serve, and they are subject to numerous risks and uncertainties that may cause these forward- looking statements to be inaccurate. Such risks and uncertainties include the timing and possible delays, deferrals and cancellations of orders by customers quarterly revenue fluctuations industry and sector cyclicality, instability and unpredictability market demand for consumer devices utilizing semiconductors produced by our clients our ability to manage costs new product introductions, market acceptance of new products and enhanced versions of our existing products reliability and technical acceptance of our products our lengthy sales cycles, and the timing of system installations and acceptances lengthy and costly development cycles for laser processing and lithography technologies and applications competition and consolidation in the markets we serve improvements, including in cost and technical features, of competitors' products rapid technological change pricing pressures and product discounts our ability to collect receivables customer and product concentration and lack of product revenue diversification inventory obsolescence general economic, financial market and political conditions and other factors outside of our control domestic and international tax policies cybersecurity threats in the United States and globally that could impact our industry, customers, and technologies and other factors described in our SEC reports including our Annual Report on Form 10 K filed for the year ended December 31, 2014 and our Quarterly Report on Form 10-Q filed for the quarterly period ended October 3, 2015. Due to these and other factors, the statements, historical results and percentage relationships set forth herein are not necessarily indicative of the results of operations for any future period. We undertake no obligation to revise or update any forward -looking statements to reflect any event or circumstance that may arise after the date of this release.
About Ultratech: Ultratech, Inc. (Nasdaq: UTEK) designs, builds and markets manufacturing systems for the global technology industry. Founded in 1979, Ultratech serves three core markets: front end semiconductor, back end semiconductor, and nanotechnology. The company is the leading supplier of lithography products for bump packaging of integrated circuits and high brightness LEDs. Ultratech is also the market leader and pioneer of laser spike anneal technology for the production of advanced semiconductor devices. In addition, the company offers solutions leveraging its proprietary coherent gradient sensing (CGS) technology to the semiconductor wafer inspection market and provides atomic layer deposition (ALD) tools to leading research organizations, including academic and industrial institutions. Visit Ultratech online at: http://www.ultratech.com.
(UTEK -G)
SOURCE Ultratech, Inc.
Ultratech, Inc.
CONTACT: Company, Ultratech, Bruce R. Wright, Senior Vice President & CFO, Phone: 408/321-8835; or The Blueshirt Group, Suzanne Schmidt, 415/217-4962, suzanne@blueshirtgroup.com; or Melanie Solomon, 415/217-4964, melanie@blueshirtgroup.com; or Agency, MCA, Inc., Angie Kellen, 650/968-8900, Senior Account Director, akellen@mcapr.com
Web Site: http://www.ultratech.com
Ultratech Introduces Superfast 4G+ Low-Cost In-Line Inspection System For Patterned Wafers
Building on the Field-Proven Superfast 4G, Ultratech's 4G+ Inspection System Provides the Industry's Lowest-Cost 3D Inspection Solution for Advanced 3D Manufacturing
SAN JOSE, Calif., Nov. 11, 2015 /PRNewswire/ -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), as well as atomic layer deposition (ALD) systems, today introduced the Superfast 4G+ in-line, 3D topography inspection system. Ultratech's new 4G+ system builds on the field leadership of the Superfast 4G, providing the industry's highest-productivity and lowest-cost solution for high-volume manufacturing. The Superfast 4G+ system's patented coherent gradient sensing (CGS) technology enables Ultratech customers to use a single type of wafer inspection tool to measure patterned wafers across the entire fab line at the lowest cost. Ultratech plans to begin shipping the Superfast 4G+ systems in the first quarter of 2016.
The Superfast 4G+ leads the industry with features including:
-- Direct, front-side 3D topography measurement for opaque and transparent
stacks patterned wafers
-- 150 wph, the highest industry 3D in-line inspection throughput with the
smallest footprint
-- 1-mm edge exclusion enabling full-wafer pattern inspection and thin-film
3D process control
-- Large bow option for in-line manufacturing control of highly bowed
wafers without impacting throughput
Damon Tsai, Ultratech Asia Director for Inspection Systems, said, "Our current leadership position in in-line 3D inspection at advanced memory and foundry manufacturers with Superfast 4G has provided us with a tremendous learning environment. Our partners have helped us develop new hardware capabilities like the 'Recipe Driven Range Control,' an innovative high-throughput, large bow optical option on board the Superfast 4G+, as well as new fleet management performance metrics. The inherently simple design of the CGS technology is enabling us to rapidly deliver new capabilities and performance improvements over more complex optical solutions."
Ultratech's Superfast 4G+ Inspection System
Based on patented CGS technology, Ultratech's Superfast 4G+ inspection system provides the industry's highest throughput (150 wph) with the lowest cost-of-ownership compared to competing systems. The direct, front-side 3D topography measurement capability is well-suited for patterned wafer applications such as lithography feed-forward overlay distortion and edge-defocus control as well as thin-film deposition stress and planarization control. Delivering a 2X improvement in performance with fleet matching TMU (Total Measurement Uncertainty), along with the ability to measure opaque and transparent stacks on patterned wafers, the Superfast 4G+ provides cost-effective technology to address the critical needs of its global customers. In addition, leveraging the same breakthrough CGS optical module, the Superfast 4G+ is available as a field upgrade of the Superfast 4G.
Safe Harbor
This release includes forward- looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Forward- looking statements can generally be identified by words such as "anticipates," "expects," "remains," "thinks," "intends," "believes," "estimates," and similar expressions and include management's current expectation of its longer term prospects for success. These forward- looking statements are based on our current expectations, estimates, assumptions and projections about our business and industry, and the markets and customers we serve, and they are subject to numerous risks and uncertainties that may cause these forward- looking statements to be inaccurate. Such risks and uncertainties include the timing and possible delays, deferrals and cancellations of orders by customers quarterly revenue fluctuations industry and sector cyclicality, instability and unpredictability market demand for consumer devices utilizing semiconductors produced by our clients our ability to manage costs new product introductions, market acceptance of new products and enhanced versions of our existing products reliability and technical acceptance of our products our lengthy sales cycles, and the timing of system installations and acceptances lengthy and costly development cycles for laser processing and lithography technologies and applications competition and consolidation in the markets we serve improvements, including in cost and technical features, of competitors' products rapid technological change pricing pressures and product discounts our ability to collect receivables customer and product concentration and lack of product revenue diversification inventory obsolescence general economic, financial market and political conditions and other factors outside of our control domestic and international tax policies cybersecurity threats in the United States and globally that could impact our industry, customers, and technologies and other factors described in our SEC reports including our Annual Report on Form 10 K filed for the year ended December 31, 2014 and our Quarterly Report on Form 10-Q filed for the quarterly period ended October 3, 2015. Due to these and other factors, the statements, historical results and percentage relationships set forth herein are not necessarily indicative of the results of operations for any future period. We undertake no obligation to revise or update any forward -looking statements to reflect any event or circumstance that may arise after the date of this release.
About Ultratech: Ultratech, Inc. (Nasdaq: UTEK) designs, builds and markets manufacturing systems for the global technology industry. Founded in 1979, Ultratech serves three core markets: front end semiconductor, back end semiconductor, and nanotechnology. The company is the leading supplier of lithography products for bump packaging of integrated circuits and high brightness LEDs. Ultratech is also the market leader and pioneer of laser spike anneal technology for the production of advanced semiconductor devices. In addition, the company offers solutions leveraging its proprietary coherent gradient sensing (CGS) technology to the semiconductor wafer inspection market and provides atomic layer deposition (ALD) tools to leading research organizations, including academic and industrial institutions. Visit Ultratech online at: http://www.ultratech.com.
(UTEK -G)
SOURCE Ultratech, Inc.
Ultratech, Inc.
CONTACT: Company, Ultratech, Bruce R. Wright, Senior Vice President & CFO, Phone: 408/321-8835; or The Blueshirt Group, Suzanne Schmidt, 415/217-4962, suzanne@blueshirtgroup.com; or Melanie Solomon, 415/217-4964, melanie@blueshirtgroup.com; or Agency, MCA, Inc., Angie Kellen, 650/968-8900, Senior Account Director, akellen@mcapr.com
Web Site: http://www.ultratech.com