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Spansion Broadens Serial Flash Portfolio With Sampling of 90nm 256 Mb MirrorBit(R) SPI Multi-I/O Product
Higher density is ideally suited for set-top-box, digital TV and industrial design applications
SUNNYVALE, Calif., March 30 -- Spansion Inc. today announced it is sampling its 90nm 256 Megabits (Mb) MirrorBit® Multi-I/O Serial Peripheral Interface (SPI) Flash memory device to set-top box, digital TV and industrial design customers and chipset manufacturers.
(Logo: http://www.newscom.com/cgi-bin/prnh/20060118/SFW077LOGO)
The 256 Mb MirrorBit SPI Multi-I/O product meets the higher density serial memory requirement that new consumer and industrial applications demand and further broadens Spansion's SPI portfolio, which already includes 32 Mb, 64 Mb and 128 Mb products that are currently shipping in volume production and supported by most chipsets.
"Our customers require higher-density SPI Flash to enable new applications and to provide improvements in performance," said Avo Kanadjian, vice president, Marketing at Spansion. "Additionally, our implementation of the 32-bit addressing scheme for 256 Mb and higher density SPI products is gaining acceptance in the industry as the preferred solution."
Multi-I/O serial devices support the option for single (one-bit data bus), dual (two-bit data bus) or quad (four-bit data bus) serial I/O data transmission from the same packaging and pins. The SPI product family also offers enhanced security features with a permanent sector lock security device that protects intellectual property and user data stored in the memory array from being changed or erased in any way after this command has been activated.
Availability
Spansion is currently sampling the 256 Mb MirrorBit SPI Multi-I/O product to customers and chipset manufacturers. Package options include BGA to support enhanced security features for set-top-box designs, and the standard SOIC 16-pin package for consumer and industrial applications. Production quantities will be available in June 2010.
About Spansion
Spansion (Pink Sheets: SPSNQ) is a leading Flash memory solutions provider, dedicated to enabling, storing and protecting digital content in automotive, consumer electronics, networking and wireless applications. Spansion is focused exclusively on designing, developing, manufacturing, marketing, selling and licensing Flash memory solutions. For more information, visit http://www.spansion.com/.
Spansion®, the Spansion logo, MirrorBit®, MirrorBit® Eclipse(TM), ORNAND(TM), EcoRAM(TM) and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.
Cautionary Statement
This release contains forward-looking statements made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Investors are cautioned that these forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those statements. The risks and uncertainties include the company's ability to: manage costs; achieve adequate liquidity; complete the chapter 11 reorganization process; execute on its new strategic focus; reach a sustainable business model; survive as a stand-alone entity; reach operational efficiency; and reach and sustain profitability. The risks and uncertainties related to the chapter 11 cases include: the company's ability to finalize, execute and obtain necessary court approvals for the definitive agreements with Spansion Japan regarding the sale of the distribution business and foundry services; depend on Spansion Japan for wafer production and distribution of products in Japan, due to actions taken by either (i) Spansion Japan (at the direction of the Spansion Japan trustee or pursuant to orders of the Japanese court in the Spansion Japan corporate reorganization proceeding or otherwise) or (ii) the company or Spansion LLC (pursuant to the orders of the U.S. Bankruptcy Court or otherwise); the company's ability to transfer wafer production capacity to another location or to a third-party foundry, or to find alternative methods of distributing and selling its products in the event that Spansion Japan is not successful or has difficulties in reorganizing; any other actions or orders taken by the U.S. Bankruptcy Court that may impact the company's operations; any negative impacts on the company's business, results of operations, financial position or cash management arrangements; the inability to freely deploy cash resources throughout the company's various geographical locations as all or part of the total worldwide cash may not be available in either the United States or for working capital as a result of limitations inherent in the chapter 11 cases in the United States or Spansion Japan's corporate reorganization proceeding or as a result of various restrictions in certain geographies; the negative impact on relationships with employees, customers, suppliers and contract manufacturers and other stakeholders; the failure of the company to obtain the U.S. Bankruptcy Court orders substantially on the terms applied for; the failure of the company to obtain the requisite approvals of affected creditors or the courts for the proposed plan or reorganization, or to successfully implement such a plan or obtain sufficient exit financing, if required, within the time granted by the U.S. Bankruptcy Court, leading to the likely liquidation of the company's assets; and that following the approval of the proposed plan of reorganization, the company's outstanding common stock will be cancelled. In addition, the instability of the global economy and tight credit markets could continue to adversely impact the company's business in several respects, including adversely impacting credit quality and insolvency risk of the company and its customers and business partners, including suppliers and distributors; bookings; and reductions and deferrals of demand for Spansion products. The company urges investors to review in detail the risks and uncertainties discussed in the company's Securities and Exchange Commission filings, including but not limited to the company's most recent Annual Report on Form 10-K for and Quarterly Reports on Form 10-Q. Unless otherwise required by applicable laws, the company undertakes no obligation to update or revise any forward-looking statements, whether as a result of new information, future events or otherwise.
Photo: http://www.newscom.com/cgi-bin/prnh/20060118/SFW077LOGO
http://photoarchive.ap.org/
PRN Photo Desk, photodesk@prnewswire.com
Source: Spansion Inc.
CONTACT: Courtney Brigham of Spansion Inc., +1-408-616-5056,
courtney.brigham@spansion.com
Web Site: http://www.spansion.com/
Spansion Broadens Serial Flash Portfolio With Sampling of 90nm 256 Mb MirrorBit(R) SPI Multi-I/O Product
Higher density is ideally suited for set-top-box, digital TV and industrial design applications
SUNNYVALE, Calif., March 30 -- Spansion Inc. today announced it is sampling its 90nm 256 Megabits (Mb) MirrorBit® Multi-I/O Serial Peripheral Interface (SPI) Flash memory device to set-top box, digital TV and industrial design customers and chipset manufacturers.
(Logo: http://www.newscom.com/cgi-bin/prnh/20060118/SFW077LOGO)
The 256 Mb MirrorBit SPI Multi-I/O product meets the higher density serial memory requirement that new consumer and industrial applications demand and further broadens Spansion's SPI portfolio, which already includes 32 Mb, 64 Mb and 128 Mb products that are currently shipping in volume production and supported by most chipsets.
"Our customers require higher-density SPI Flash to enable new applications and to provide improvements in performance," said Avo Kanadjian, vice president, Marketing at Spansion. "Additionally, our implementation of the 32-bit addressing scheme for 256 Mb and higher density SPI products is gaining acceptance in the industry as the preferred solution."
Multi-I/O serial devices support the option for single (one-bit data bus), dual (two-bit data bus) or quad (four-bit data bus) serial I/O data transmission from the same packaging and pins. The SPI product family also offers enhanced security features with a permanent sector lock security device that protects intellectual property and user data stored in the memory array from being changed or erased in any way after this command has been activated.
Availability
Spansion is currently sampling the 256 Mb MirrorBit SPI Multi-I/O product to customers and chipset manufacturers. Package options include BGA to support enhanced security features for set-top-box designs, and the standard SOIC 16-pin package for consumer and industrial applications. Production quantities will be available in June 2010.
About Spansion
Spansion (Pink Sheets: SPSNQ) is a leading Flash memory solutions provider, dedicated to enabling, storing and protecting digital content in automotive, consumer electronics, networking and wireless applications. Spansion is focused exclusively on designing, developing, manufacturing, marketing, selling and licensing Flash memory solutions. For more information, visit http://www.spansion.com/.
Spansion®, the Spansion logo, MirrorBit®, MirrorBit® Eclipse(TM), ORNAND(TM), EcoRAM(TM) and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.
Cautionary Statement
This release contains forward-looking statements made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Investors are cautioned that these forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those statements. The risks and uncertainties include the company's ability to: manage costs; achieve adequate liquidity; complete the chapter 11 reorganization process; execute on its new strategic focus; reach a sustainable business model; survive as a stand-alone entity; reach operational efficiency; and reach and sustain profitability. The risks and uncertainties related to the chapter 11 cases include: the company's ability to finalize, execute and obtain necessary court approvals for the definitive agreements with Spansion Japan regarding the sale of the distribution business and foundry services; depend on Spansion Japan for wafer production and distribution of products in Japan, due to actions taken by either (i) Spansion Japan (at the direction of the Spansion Japan trustee or pursuant to orders of the Japanese court in the Spansion Japan corporate reorganization proceeding or otherwise) or (ii) the company or Spansion LLC (pursuant to the orders of the U.S. Bankruptcy Court or otherwise); the company's ability to transfer wafer production capacity to another location or to a third-party foundry, or to find alternative methods of distributing and selling its products in the event that Spansion Japan is not successful or has difficulties in reorganizing; any other actions or orders taken by the U.S. Bankruptcy Court that may impact the company's operations; any negative impacts on the company's business, results of operations, financial position or cash management arrangements; the inability to freely deploy cash resources throughout the company's various geographical locations as all or part of the total worldwide cash may not be available in either the United States or for working capital as a result of limitations inherent in the chapter 11 cases in the United States or Spansion Japan's corporate reorganization proceeding or as a result of various restrictions in certain geographies; the negative impact on relationships with employees, customers, suppliers and contract manufacturers and other stakeholders; the failure of the company to obtain the U.S. Bankruptcy Court orders substantially on the terms applied for; the failure of the company to obtain the requisite approvals of affected creditors or the courts for the proposed plan or reorganization, or to successfully implement such a plan or obtain sufficient exit financing, if required, within the time granted by the U.S. Bankruptcy Court, leading to the likely liquidation of the company's assets; and that following the approval of the proposed plan of reorganization, the company's outstanding common stock will be cancelled. In addition, the instability of the global economy and tight credit markets could continue to adversely impact the company's business in several respects, including adversely impacting credit quality and insolvency risk of the company and its customers and business partners, including suppliers and distributors; bookings; and reductions and deferrals of demand for Spansion products. The company urges investors to review in detail the risks and uncertainties discussed in the company's Securities and Exchange Commission filings, including but not limited to the company's most recent Annual Report on Form 10-K for and Quarterly Reports on Form 10-Q. Unless otherwise required by applicable laws, the company undertakes no obligation to update or revise any forward-looking statements, whether as a result of new information, future events or otherwise.
Photo: http://www.newscom.com/cgi-bin/prnh/20060118/SFW077LOGO
http://photoarchive.ap.org/
PRN Photo Desk, photodesk@prnewswire.com
Source: Spansion Inc.
CONTACT: Courtney Brigham of Spansion Inc., +1-408-616-5056,
courtney.brigham@spansion.com
Web Site: http://www.spansion.com/