Qualcomm Ships First Dual-CPU Snapdragon Chipset
Poster: SySAdmin
Posted on May 31, 2010 at 8:07:01 PM
Qualcomm Ships First Dual-CPU Snapdragon Chipset
Third-generation Snapdragon Solutions Feature Two Application Processor Cores Running up to 1.2 GHz to Enable Advanced Smartphones
TAIPEI, Taiwan, June 1 -- Qualcomm Incorporated (NASDAQ:QCOM), a leading developer and innovator of wireless technologies, products and services, today announced the Company has sampled its first dual-CPU Snapdragon(TM) chipsets. The Mobile Station Modem(TM) (MSM(TM)) MSM8260(TM) and MSM8660(TM) solutions integrate two of the Company's enhanced cores running at up to 1.2GHz. Targeted at enabling high-end smartphones, the MSM8x60 solutions are third-generation chipsets from the Company's expanded Snapdragon platform, which has been powering smartphones, tablets and smartbook devices in markets around the world.
"Qualcomm's first-generation Snapdragon chipsets set a new standard for advanced smartphones and smartbook devices, and our second-generation solutions are already shipping in volume," said Steve Mollenkopf, executive vice president of Qualcomm and president of Qualcomm CDMA Technologies. "We are very excited by the innovation our customers are already showing as they begin designing products based on our dual-core MSM8260 and MSM8660 chipsets."
The MSM8260 for HSPA+ and MSM8660 for multi-mode HSPA+/CDMA2000® 1xEV-DO Rev. B feature two enhanced CPU cores running at up to 1.2GHz for high levels of Web application and multimedia performance, including a powerful GPU with 3D/2D acceleration engines for Open GLES 2.0 and Open VG 1.1 accelration, 1080p video encode/decode, dedicated low power audio engine, integrated low power GPS, and support for 24-bit WXGA 1280 x 800 resolution displays.
Qualcomm's Snapdragon family of chipset solutions includes:
-- First-generation products: QSD8x50(TM) with 1GHz enhanced core
-- Second-generation products: MSM8x55(TM) and QSD8x50A(TM) with 1GHz
enhanced core, including multimedia optimizations and 1.3GHz enhanced
core, respectively
-- Third-generation products: MSM8260, MSM8660 and QSD8672 with dual-CPU
architecture featuring enhanced cores running at up to 1.2GHz and
1.5GHz, respectively
Qualcomm Incorporated (NASDAQ:QCOM) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 100 Index, the S&P 500 Index and is a 2010 FORTUNE 500 company. For more information, please visit Qualcomm around the Web:
http://www.qualcomm.com
Blog: http://www.qualcomm.com/blog
Twitter: http://www.twitter.com/qualcomm
Facebook: http://www.facebook.com/qualcomm
.
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of ASIC components on a timely and profitable basis, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 27, 2009, and most recent Form 10-Q.
Qualcomm is a registered trademark of Qualcomm Incorporated. Mobile Station Modem , MSM, MSM8260, MSM8660, MSM8x55, QSD8x50, QSD8x50A, and Snapdragon are trademarks of Qualcomm Incorporated. CDMA2000 is a registered trademark of the Telecommunications Industry Association (TIA USA). All other trademarks are the property of their respective owners.
In the territory of the Federal Republic of Germany, the use of the term "Smartbook" in connection with portable computers is reserved exclusively to Smartbook AG, Germany.
Qualcomm Contacts:
Kira Lee Golin, Qualcomm CDMA Technologies
Phone: 1-858-651-1554
Email: qctpublicrelations@qualcomm.com
Tina Asmar, Corporate Communications
Phone: 1-858-845-5959
Email: corpcomm@qualcomm.com
Warren Kneeshaw, Investor Relations
Phone: 1-858-658-4813
Email: ir@qualcomm.com
Source: Qualcomm Incorporated
CONTACT: Kira Lee Golin, Qualcomm CDMA Technologies, +1-858-651-1554,
qctpublicrelations@qualcomm.com, or Tina Asmar, Corporate Communications,
+1-858-845-5959, corpcomm@qualcomm.com, or Warren Kneeshaw, Investor
Relations, +1-858-658-4813, ir@qualcomm.com
Web Site: http://www.qualcomm.com/
Third-generation Snapdragon Solutions Feature Two Application Processor Cores Running up to 1.2 GHz to Enable Advanced Smartphones
TAIPEI, Taiwan, June 1 -- Qualcomm Incorporated (NASDAQ:QCOM), a leading developer and innovator of wireless technologies, products and services, today announced the Company has sampled its first dual-CPU Snapdragon(TM) chipsets. The Mobile Station Modem(TM) (MSM(TM)) MSM8260(TM) and MSM8660(TM) solutions integrate two of the Company's enhanced cores running at up to 1.2GHz. Targeted at enabling high-end smartphones, the MSM8x60 solutions are third-generation chipsets from the Company's expanded Snapdragon platform, which has been powering smartphones, tablets and smartbook devices in markets around the world.
"Qualcomm's first-generation Snapdragon chipsets set a new standard for advanced smartphones and smartbook devices, and our second-generation solutions are already shipping in volume," said Steve Mollenkopf, executive vice president of Qualcomm and president of Qualcomm CDMA Technologies. "We are very excited by the innovation our customers are already showing as they begin designing products based on our dual-core MSM8260 and MSM8660 chipsets."
The MSM8260 for HSPA+ and MSM8660 for multi-mode HSPA+/CDMA2000® 1xEV-DO Rev. B feature two enhanced CPU cores running at up to 1.2GHz for high levels of Web application and multimedia performance, including a powerful GPU with 3D/2D acceleration engines for Open GLES 2.0 and Open VG 1.1 accelration, 1080p video encode/decode, dedicated low power audio engine, integrated low power GPS, and support for 24-bit WXGA 1280 x 800 resolution displays.
Qualcomm's Snapdragon family of chipset solutions includes:
-- First-generation products: QSD8x50(TM) with 1GHz enhanced core
-- Second-generation products: MSM8x55(TM) and QSD8x50A(TM) with 1GHz
enhanced core, including multimedia optimizations and 1.3GHz enhanced
core, respectively
-- Third-generation products: MSM8260, MSM8660 and QSD8672 with dual-CPU
architecture featuring enhanced cores running at up to 1.2GHz and
1.5GHz, respectively
Qualcomm Incorporated (NASDAQ:QCOM) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 100 Index, the S&P 500 Index and is a 2010 FORTUNE 500 company. For more information, please visit Qualcomm around the Web:
http://www.qualcomm.com
Blog: http://www.qualcomm.com/blog
Twitter: http://www.twitter.com/qualcomm
Facebook: http://www.facebook.com/qualcomm
.
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of ASIC components on a timely and profitable basis, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 27, 2009, and most recent Form 10-Q.
Qualcomm is a registered trademark of Qualcomm Incorporated. Mobile Station Modem , MSM, MSM8260, MSM8660, MSM8x55, QSD8x50, QSD8x50A, and Snapdragon are trademarks of Qualcomm Incorporated. CDMA2000 is a registered trademark of the Telecommunications Industry Association (TIA USA). All other trademarks are the property of their respective owners.
In the territory of the Federal Republic of Germany, the use of the term "Smartbook" in connection with portable computers is reserved exclusively to Smartbook AG, Germany.
Qualcomm Contacts:
Kira Lee Golin, Qualcomm CDMA Technologies
Phone: 1-858-651-1554
Email: qctpublicrelations@qualcomm.com
Tina Asmar, Corporate Communications
Phone: 1-858-845-5959
Email: corpcomm@qualcomm.com
Warren Kneeshaw, Investor Relations
Phone: 1-858-658-4813
Email: ir@qualcomm.com
Source: Qualcomm Incorporated
CONTACT: Kira Lee Golin, Qualcomm CDMA Technologies, +1-858-651-1554,
qctpublicrelations@qualcomm.com, or Tina Asmar, Corporate Communications,
+1-858-845-5959, corpcomm@qualcomm.com, or Warren Kneeshaw, Investor
Relations, +1-858-658-4813, ir@qualcomm.com
Web Site: http://www.qualcomm.com/